Packaging innovations help engineers break free from design constraints

被引：0
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作者：
Donlin, Mike
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来源：
Electronic Systems Technology and Design/Computer Design's | 1993年 / 32卷 / 06期
关键词：
Ceramic materials - Integrated circuits;
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暂无
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摘要：
Until recently, IC packaging has been an afterthought for system designers who were too busy pursuing the latest in silicon technology to worry about its plastic or ceramic housing. But the lowly package threatens to hinder next-generation silicon performance unless designers free themselves from the limitations of DIPs, SOICs and solder.
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