共 50 条
- [31] STATE-OF-THE-ART ELECTRONIC CONNECTORS - PART 1. Assembly engineering, 1982, 25 (11): : 12 - 15
- [34] Part 1: Specifying base materials for SMT circuit boards SMT Surface Mount Technology Magazine, 2005, 19 (06):
- [35] THERMAL AND THERMOMECHANICAL ANALYSIS AND TESTING OF ELECTRONIC PACKAGING SYSTEMS JOHNS HOPKINS APL TECHNICAL DIGEST, 1986, 7 (03): : 279 - 283
- [37] Magnetic particle testing: Part 1. Introduction and magnetization Insight: Non-Destructive Testing and Condition Monitoring, 1998, 40 (01): : 53 - 55
- [40] Thermal diffusivity and porosity of solid materials by the electromagnetic ultrasonic technique. Part 1. the principle of measurement Heat Transfer - Japanese Research, 1993, 22 (08): : 780 - 795