Adhesive and coating materials ... Modern adhesive systems for electronics manufacture

被引:0
|
作者
Tetzner, Gert [1 ]
机构
[1] Panakol-Elosol GmbH, Oberursel, Germany
来源
Adhaesion Kleben und Dichten | 2002年 / 46卷 / 06期
关键词
Electron devices;
D O I
暂无
中图分类号
TM [电工技术];
学科分类号
0808 ;
摘要
Modern adhesive systems protect electronics wiring and components against bypassing conditions, reduce the general dimensions of electronic devices and improve the service life of the products. Several examples of using those systems for electronics manufacture are presented and discussed. It is shown how Clob-Top materials protect the wiring of electronic devices against environmental effects. The so-called Frame-and-Fill technique that uses modern adhesive systems becomes an important alternative to expensive metallic frames. New cost-efficient adhesives are being developed for the Chip-Bonding technology.
引用
收藏
页码:18 / 19
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