FRETTING CORROSION OF TIN-PLATED COPPER ALLOY.

被引:0
|
作者
Lee, Anthony [1 ]
Mamrick, Michael S. [1 ]
机构
[1] GM Research Lab, Warren, MI, USA, GM Research Lab, Warren, MI, USA
关键词
D O I
暂无
中图分类号
学科分类号
摘要
COPPER AND ALLOYS
引用
收藏
页码:63 / 67
相关论文
共 50 条
  • [41] Property of Tin Oxide Film Formed on Tin-Plated Connector Contacts
    Tamai, Terutaka
    Nabeta, Yuya
    Sawada, Shigeru
    Hattori, Yasuhiro
    PROCEEDINGS OF THE FIFTY-SIXTH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS, 2010, : 295 - 302
  • [42] MUTUAL DIFFUSION OF TIN AND COPPER IN THE SYSTEM COPPER-GALVANIC COATING OF TIN ALLOY.
    Slepushkin, V.V.
    Mukovnina, G.S.
    Yartsev, M.G.
    1984, (20):
  • [43] Evaluation of pure tin plated copper alloy substrates for tin whiskers
    Mathew, Sony
    Osterman, Michael
    Pecht, Michael
    Dunlevey, Frank
    CIRCUIT WORLD, 2009, 35 (01) : 3 - 8
  • [44] Reliability of microelectronic packages with tin-plated copper leads under high humidity operating environment
    Seng, Yeoh Lai
    EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 894 - 899
  • [45] DETERMINATION OF THICKNESS OF PASSIVE FILMS ON ELECTROLYTICALLY TIN-PLATED SHEETS
    KATSER, IM
    PETROVA, OA
    PARAMONO.VA
    CHERNYAE.ND
    ZAVODSKAYA LABORATORIYA, 1972, 38 (11): : 1364 - 1365
  • [46] DISSOLUTION OF THE COATING OF TIN-PLATED STEEL IN ACID-SOLUTIONS
    BADRAN, MM
    WAHAB, FMA
    SALEH, RM
    ELHOSARY, AA
    SURFACE TECHNOLOGY, 1984, 23 (02): : 143 - 150
  • [47] Simulation for fretting corrosion of tin-coated copper contacts
    Lee, K. Y.
    Jeong, D. K.
    Joo, H. G.
    Park, Y. W.
    MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2011, 62 (04): : 352 - 356
  • [48] COMPARISON OF THE ADHESIVE STRENGTH OF A BIS-GMA CEMENT TO TIN-PLATED AND NON-TIN-PLATED ALLOYS
    GATES, WD
    DIAZARNOLD, AM
    AQUILINO, SA
    RYTHER, JS
    JOURNAL OF PROSTHETIC DENTISTRY, 1993, 69 (01): : 12 - 16
  • [49] TEM analysis of whiskers formation over tin-plated films
    Otsubo, Fumitaka
    Era, Hidenori
    Tsuru, Yutaka
    Hirano, Shigeru
    MATERIALS CHEMISTRY AND PHYSICS, 2020, 251
  • [50] SILVER-PLATED AND TIN-PLATED WIRE-WRAP WIRE DEFICIENCIES AND AN ALTERNATIVE COATING
    SAVI, J
    NOON, DW
    LAROSE, RC
    MATERIALS PERFORMANCE, 1985, 24 (03) : 16 - 19