Inspection of solder paste deposition for chip scale assembly

被引：0
|
作者：
General Scanning Inc, Ann Arbor, United States [1 ]
机构：
来源：
Natl Electron Packag Prod Conf Proc Tech Program | / 981-983期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] iNEMI Solder Paste Deposition Project - First Stage Review Optimizing Solder Paste Printing for Large and Small Components
    Zhang, Shoukai
    Mohanty, Rita
    Jiang, Xiaodong
    Mao, Runsheng
    Lee, Jeffery ChangBing
    Xia, Chuan
    Sweatman, Keith
    Teoh, Desmond
    [J]. IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 543 - +
  • [32] Solder paste inspection using region-based defect detection
    Tak-Wai Hui
    Grantham Kwok-Hung Pang
    [J]. The International Journal of Advanced Manufacturing Technology, 2009, 42 (7-8) : 735 - 735
  • [33] Solder paste inspection using region-based defect detection
    Hui, Tak-Wai
    Pang, Grantham Kwok-Hung
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2009, 42 (7-8): : 725 - 734
  • [34] Solder paste inspection by structured light methods based on phase measurement
    DiStefano, L
    Boland, F
    [J]. AUTOMATED OPTICAL INSPECTION FOR INDUSTRY, 1996, 2899 : 702 - 713
  • [35] Solder paste inspection using region-based defect detection
    Tak-Wai Hui
    Grantham Kwok-Hung Pang
    [J]. The International Journal of Advanced Manufacturing Technology, 2009, 42 : 725 - 734
  • [36] A Real-time Machine Vision System for Solder Paste Inspection
    Wu, Huihui
    Zhang, Xianmin
    Kuang, Yongcong
    Lu, Shenglin
    [J]. 2008 IEEE/ASME INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS, VOLS 1-3, 2008, : 205 - 210
  • [37] Eutectic solder flip chip technology for Chip Scale Package
    Takubo, C
    Hirano, N
    Doi, K
    Tazawa, H
    Hosomi, E
    Hiruta, Y
    [J]. NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 488 - 493
  • [38] Solder Attributes Paste for System-in-Package (SiP) Assembly
    Lim, Sze Pei
    Thum, Kenneth
    Mackie, Andy C.
    [J]. Advancing Microelectronics, 2021, 48 (02): : 34 - 39
  • [39] Flip chip solder bump inspection using vibration analysis
    Junchao Liu
    Tielin Shi
    Qi Xia
    Guanglan Liao
    [J]. Microsystem Technologies, 2012, 18 : 303 - 309
  • [40] Flip chip solder bump inspection using vibration analysis
    Liu, Junchao
    Shi, Tielin
    Xia, Qi
    Liao, Guanglan
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (03): : 303 - 309
12345