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- [31] Advanced Seed Layer of Cu Wiring for Printed Circuit Board with Sputtering Method 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 362 - 366
- [33] A METHOD OF MEASURING THE DIELECTRIC CONSTANT OF ISOTROPIC POWDERS PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1954, 67 (411): : 267 - 269