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- [1] A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials 9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS, 2004, : 241 - 246
- [2] Evaluation and Analysis Technologies for Printed Wiring Board Materials FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2010, 46 (03): : 285 - 291
- [3] STUDY ON THERMALLY STABLE PRINTED WIRING BOARD MATERIALS REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1977, 25 (3-4): : 353 - 359
- [4] Evaluation and analysis technologies for printed wiring board materials Fujitsu Scientific and Technical Journal, 2010, 46 (03): : 285 - 291
- [5] Trend of halogen free printed wiring board materials SECOND INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 2001, : 1026 - 1031
- [6] Nondestructive Method for Measuring Dielectric Constant of Sheet Materials 2011 IEEE REGION 10 CONFERENCE TENCON 2011, 2011, : 1105 - 1109
- [8] METHOD OF PUTTING A SLOT IN A PRINTED WIRING BOARD. IBM technical disclosure bulletin, 1985, 28 (06): : 2464 - 2465
- [10] Effects of Moisture Content on Dielectric Constant and Dissipation Factor of Printed Circuit Board Materials CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 227 - 236