ELECTRICAL PERFORMANCE OF HIGH-SPEED INTERCONNECT SYSTEMS.

被引:0
|
作者
Scheinfein, Michael R. [1 ]
Liao, J.C. [1 ]
Palusinski, Olgierd A. [1 ]
Prince, John L. [1 ]
机构
[1] Univ of Arizona, Tucson, AZ, USA, Univ of Arizona, Tucson, AZ, USA
来源
| 1600年 / CHMT-10期
关键词
ELECTRICAL PERFORMANCE - HIGH-SPEED INTERCONNECT SYSTEMS - IC INTERCONNECTIONS;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Elements of high-speed digital interconnect design
    Chandra, Mahesh
    Raghupathy, G.
    Printed Circuit Design, 2000, 17 (06):
  • [33] High-speed interconnect schemes for a pipelined FPGA
    Lee, HJ
    Flynn, MJ
    IEE PROCEEDINGS-COMPUTERS AND DIGITAL TECHNIQUES, 2000, 147 (03): : 195 - 202
  • [34] The rapidio high-speed interconnect: A technical overview
    Shippen, Greg
    ELECTRONICS WORLD, 2007, 113 (1857): : 18 - 21
  • [35] Performance bounds for high-speed communications systems
    Dai, LY
    PROCEEDINGS OF THE 35TH IEEE CONFERENCE ON DECISION AND CONTROL, VOLS 1-4, 1996, : 797 - 802
  • [36] Performance and efficiency of High-speed Rail systems
    Doomernik, Jack E.
    CURRENT PRACTICES IN TRANSPORT: APPRAISAL METHODS, POLICIES AND MODELS, 42ND EUROPEAN TRANSPORT CONFERENCE SELECTED PROCEEDINGS, 2015, 8 : 136 - 144
  • [37] PERFORMANCE MODELING OF HIGH-SPEED TELECOMMUNICATION SYSTEMS
    GANZ, A
    GRILLO, D
    TAKAGI, H
    TANTAWI, A
    PERFORMANCE EVALUATION, 1992, 16 (1-3) : 1 - 4
  • [38] Efficient Performance Evaluation of High-Speed Differential Interconnect Lines with Via Discontinuities
    Kim, Hyewon
    Lee, Junghyun
    Eo, Yungseon
    2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2013, : 207 - 210
  • [39] Modeling and analysis techniques of jitter enhancement across high-speed interconnect systems
    Beyene, Wendemagegnehu Wendem
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2007, : 29 - 32
  • [40] A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems
    Griese, E
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (03): : 375 - 383