High-precision working

被引：0

|

作者：

Krause, Joachim ^{[1
]}

机构：

[1] Siemens, Bruchsal, Germany

来源：

Printed Circuit Fabrication | 2000年 / 23卷 / 03期

关键词：

Ball grid array - Chip scale packages - Laser structuring;

D O I：

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中图分类号：

学科分类号：

摘要：

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页码：26 / 28

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