High-precision working

被引：0
|
作者：
Krause, Joachim [1 ]
机构：
[1] Siemens, Bruchsal, Germany
来源：
Printed Circuit Fabrication | 2000年 / 23卷 / 03期
关键词：
Ball grid array - Chip scale packages - Laser structuring;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：26 / 28
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