GOLD ON PALLADIUM CONNECTOR CONTACTS.

被引：0

作者：

Bonney, W.

机构：

来源：

EP Electronic Production (London) | 1983年 / 12卷 / 11期

关键词：

ELECTRIC CONNECTORS - GOLD AND ALLOYS - Plating - PALLADIUM AND ALLOYS - Plating;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A new plating combination of 0. 1 microns gold over a palladium layer 0. 6 microns thick with a 1. 5 microns thick nickel underplate is considered for contacts for the recently introduced M50 range of flat cable connectors. Tests are carried out that consist of high temperature endurance; damp heat steady state; thermal shock; electrical load at high temperature, and industrial atmosphere test. It is demonstrated that alternatives to conventional gold plating can give equivalent or superior performance at reduced cost.

引用

共 50 条

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不详
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