GOLD ON PALLADIUM CONNECTOR CONTACTS.

被引：0
|
作者：
Bonney, W.
机构：
来源：
EP Electronic Production (London) | 1983年 / 12卷 / 11期
关键词：
ELECTRIC CONNECTORS - GOLD AND ALLOYS - Plating - PALLADIUM AND ALLOYS - Plating;
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学科分类号：
摘要：
A new plating combination of 0. 1 microns gold over a palladium layer 0. 6 microns thick with a 1. 5 microns thick nickel underplate is considered for contacts for the recently introduced M50 range of flat cable connectors. Tests are carried out that consist of high temperature endurance; damp heat steady state; thermal shock; electrical load at high temperature, and industrial atmosphere test. It is demonstrated that alternatives to conventional gold plating can give equivalent or superior performance at reduced cost.
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