Influence of plating tin and alumina on electrochemical behavior of lead alloys electrodes

被引：0
|
作者：
Chen, H.Y.
Huang, Q.M.
Wu, L.
Jiang, X.
Liang, X.P.
Zhang, Y.Y.
Huang, M.X.
机构：
来源：
Dianyuan Jishu/Chinese Journal of Power Sources | 2001年 / 25卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Electrochemical behavior of the lead-tin couple in carbonate solutions
    Derge, G
    Markus, H
    Grobe, AH
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1942, 147 : 310 - 316
  • [42] IMPURITY INFLUENCE ON THE INTERRUPTED DECOMPOSITION OF LEAD-TIN ALLOYS
    AFANASYEV, NI
    YELSUKOVA, TF
    FIZIKA METALLOV I METALLOVEDENIE, 1984, 57 (01): : 96 - 101
  • [43] ELECTROLYTIC DEPOSITION OF LEAD, TIN AN LEAD-TIN ALLOYS
    BENNINGHOFF, H
    METALL, 1979, 33 (09): : 983 - 983
  • [44] Tin-lead plating on encapsulated semiconductor lead frames
    Foppen, Robert, 1600, (91):
  • [45] STUDIES ON THE BRIGHT TIN LEAD PLATING PROCESS
    ZHANG, LM
    YE, JD
    XIONG, G
    PLATING AND SURFACE FINISHING, 1987, 74 (02): : 52 - 52
  • [46] DENSITIES OF LIQUID TIN LEAD AND TIN-LEAD ALLOYS
    THRESH, HR
    CRAWLEY, AF
    WHITE, DWG
    TRANSACTIONS OF THE METALLURGICAL SOCIETY OF AIME, 1968, 242 (05): : 819 - &
  • [47] TIN AND TIN-LEAD PLATING .4. REFLOWING TIN DEPOSITS
    HIRSCH, S
    METAL FINISHING, 1985, 83 (01) : 31 - 32
  • [48] ELECTRODEPOSITION OF TIN AND LEAD-TIN ALLOYS
    STEEG, HJ
    METALL, 1976, 30 (09): : 834 - 839
  • [49] Study on the microstructure and electrochemical properties of lead-calcium-tin-aluminum alloys
    Li, H.
    Guo, W. X.
    Chen, H. Y.
    Finlow, D. E.
    Zhou, H. W.
    Dou, C. L.
    Xiao, G. M.
    Peng, S. G.
    Wei, W. W.
    Wang, H.
    JOURNAL OF POWER SOURCES, 2009, 191 (01) : 111 - 118
  • [50] CORROSION OF LEAD, TIN, AND THEIR ALLOYS
    BRUSIC, V
    DIMILIA, DD
    MACINNES, R
    CORROSION, 1991, 47 (07) : 509 - 518
12345