Coupling on a multilayer printed circuit board and the current distribution in the ground plane

被引:0
|
作者
van, Horck, F.B.M.
van Deursen, A.P.J.
van der Laan, P.C.T.
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Advanced Manufacturing Technology of Microwave Multilayer Printed Circuit Board
    Zhang, Zhaohang
    Yang, Weisheng
    Liu, Jinfeng
    Chen, Xu
    Zhu, Jianjun
    PROCEEDINGS OF THE SEVENTH ASIA INTERNATIONAL SYMPOSIUM ON MECHATRONICS, VOL II, 2020, 589 : 155 - 162
  • [22] Multilayer printed circuit board analysis of interlayer adhesion failure
    Abys, JA
    PLATING AND SURFACE FINISHING, 2001, 88 (01): : 64 - 65
  • [23] Simulation and fabrication of embedded capacitors in the multilayer printed circuit board
    You, Hee-Wook
    Kim, Se-Ho
    Koh, Jung-Hyuk
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (09) : 7707 - 7710
  • [24] EVALUATION OF EFFECTIVE THERMAL CONDUCTIVITY OF MULTILAYER PRINTED CIRCUIT BOARD
    Tomimura, Toshio
    Shiotsu, Yoshihiro
    Koito, Yasushi
    Ishizuka, Masaru
    Hatakeyama, Tomoyuki
    PROCEEDINGS OF THE ASME/JSME 8TH THERMAL ENGINEERING JOINT CONFERENCE 2011, VOL 1 PTS A AND B, 2011, : 1163 - +
  • [25] Differential Vias Transition Modeling in a Multilayer Printed Circuit Board
    Cocchini, Matteo
    Cheng, Wheling
    Zhang, Jianmin
    Fisher, John
    Fan, Jun
    Drewniak, James L.
    Zhang, Yaojiang
    2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 861 - +
  • [26] Simulation and fabrication of embedded capacitors in the multilayer printed circuit board
    You, Hee-Wook
    Kim, Se-Ho
    Koh, Jung-Hyuk
    1600, Japan Society of Applied Physics (47):
  • [27] Coupling of External Electromagnetic Field to Printed Circuit Board
    Wang, Longfeng
    Su, Donglin
    Wang, Yi
    ISAPE 2008: THE 8TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY, PROCEEDINGS, VOLS 1-3, 2008, : 1156 - 1159
  • [28] Estimation of printed circuit board ground plane net partial inductance via noise voltage measurements
    Leferink, FBJ
    van Etten, WC
    2003 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD, VOLS 1 AND 2, 2003, : 242 - 247
  • [29] Discrete out-of-plane coupling components for printed circuit board-level optical interconnections
    Van Erps, Juergen
    Hendrickx, Nina
    Debaes, Christof
    Van Daele, Peter
    Thienpont, Hugo
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2007, 19 (21-24) : 1753 - 1755
  • [30] Circuit modeling of power/ground plane structures for printed circuit boards
    Huang, CC
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2005, 47 (01) : 97 - 99