Coupling on a multilayer printed circuit board and the current distribution in the ground plane

被引:0
|
作者
van, Horck, F.B.M.
van Deursen, A.P.J.
van der Laan, P.C.T.
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [2] Power and ground analysis in multilayer printed circuit board
    E Functional Module R and D, Oki Printed Circuits Co., Ltd., 1 Fukudacho, Joetsu-Shi, Niigata 942-0032, Japan
    J. Jpn. Inst. Electron. Packag., 2009, 3 (186-189):
  • [3] Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane
    Tsang, L
    Miller, D
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (04): : 375 - 384
  • [4] Estimation of Current Distribution on Multilayer Printed Circuit Board by Near-Field Measurement
    Chen, Qiang
    Kato, Sumito
    Sawaya, Kunio
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2008, 50 (02) : 399 - 405
  • [5] Current distribution analysis on printed circuit board
    Doi, T
    Yoshida, S
    Masuda, N
    Tohya, H
    Saito, Y
    PESC 98 RECORD - 29TH ANNUAL IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1 AND 2, 1998, : 1134 - 1139
  • [6] Failure Analysis of Leakage Current for Multilayer Printed Circuit Board
    Xiang Wang
    Wangping Wu
    Dingkai Xie
    Peng Jiang
    Zhizhi Wang
    Yi Zhang
    Journal of Failure Analysis and Prevention, 2020, 20 : 1621 - 1627
  • [7] Failure Analysis of Leakage Current for Multilayer Printed Circuit Board
    Wang, Xiang
    Wu, Wangping
    Xie, Dingkai
    Jiang, Peng
    Wang, Zhizhi
    Zhang, Yi
    JOURNAL OF FAILURE ANALYSIS AND PREVENTION, 2020, 20 (05) : 1621 - 1627
  • [8] Power distribution modeling and decoupling of multilayer printed circuit board
    Bandyopadhyay, Jaya
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 1999, : 103 - 106
  • [9] Analysis of Radiation Coupling from Via in Multilayer Printed Circuit Board Traces
    Ghosh, Avali
    Das, Sisir Kumar
    Das, Annapurna
    2016 14TH INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY (INCEMIC-2016), 2016,
  • [10] Design of the current driver for inducing radiating ground edge current in a printed circuit board
    Liu, T-I.
    Wang, Y-S.
    Chung, S. -J.
    IET MICROWAVES ANTENNAS & PROPAGATION, 2012, 6 (06) : 627 - 635