PRINTED WIRING BACKPLANES REACH HIGH PERFORMANCE LEVELS.

被引：0

作者：

Ginsberg, Gerald L. ^{[1
]}

机构：

[1] Electronic Packaging &, Production, Denver, CO, USA, Electronic Packaging & Production, Denver, CO, USA

来源：

Electronic Packaging and Production | 1985年 / 25卷 / 04期

关键词：

D O I：

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中图分类号：

学科分类号：

摘要：

PRINTED CIRCUITS

引用

页码：48 / 54

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