PRINTED WIRING BACKPLANES REACH HIGH PERFORMANCE LEVELS.

被引:0
|
作者
Ginsberg, Gerald L. [1 ]
机构
[1] Electronic Packaging &, Production, Denver, CO, USA, Electronic Packaging & Production, Denver, CO, USA
来源
Electronic Packaging and Production | 1985年 / 25卷 / 04期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
PRINTED CIRCUITS
引用
收藏
页码:48 / 54
相关论文
共 50 条
  • [1] HIGH-PERFORMANCE MATERIALS FOR PRINTED WIRING BOARDS
    GUILES, CL
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 349 - 359
  • [2] Transfer-Printed Microscale Integrated Circuits for High Performance Display Backplanes
    Bower, Christopher A.
    Menard, Etienne
    Bonafede, Salvatore
    Hamer, John W.
    Cok, Ronald S.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (12): : 1916 - 1922
  • [3] Polymer transistor display backplanes: High performance inkjet printed devices.
    Arias, AC
    Ready, S
    Lujan, R
    Wong, WS
    Paul, KE
    Chabinyc, ML
    Salleo, A
    Apte, R
    Street, RA
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 229 : U1128 - U1128
  • [4] Applications of closed-form wiring escape formulae to a high performance printed wiring board
    Zhou, TD
    Katopis, GA
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 225 - 228
  • [5] MONITORING PERFORMANCE LEVELS.
    Grieco Jr., Peter L.
    Production and Inventory Management Journal, 1980, 21 (04): : 38 - 42
  • [6] NEW HIGH-PERFORMANCE EPOXY LAMINATES FOR PRINTED WIRING BOARDS
    PAPATHOMAS, KI
    JAPP, RM
    KOHUT, GP
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1995, 210 : 156 - POLY
  • [7] MICROWAVE TUBES REACH NEW POWER AND EFFICIENCY LEVELS.
    Bierman, Howard
    Microwave journal, 1987, 30 (02): : 26 - 42
  • [8] HIGH-SPEED WIRING TEST SYSTEM FOR PRINTED WIRING BOARD
    ITOH, S
    HOSHIAI, F
    SUZUKI, M
    NEC RESEARCH & DEVELOPMENT, 1978, (49): : 32 - 39
  • [9] Quality assurance for rotary screen printed wiring backplanes with automated roll-to-roll electrical test equipment
    Happonen, Tuomas
    Kokko, Tuomas
    Juntunen, Eveliina
    Ronka, Kari
    FLEXIBLE AND PRINTED ELECTRONICS, 2019, 4 (02):
  • [10] Design considerations for high-performance backplanes
    Cosimano, Ray
    Electronic Design, 1998, 46 (13):