Smart integration and packaging of 2-D VCSEL's for high-speed parallel links

被引：0
|
作者：
Kosaka, Hideo [1 ]
机构：
[1] NEC Opto-Electronics Res. Labs., Tsukuba, Ibaraki 305, Japan
来源：
IEEE Journal on Selected Topics in Quantum Electronics | / 5卷 / 02期
关键词：
Integrated optoelectronics - Optical interconnects - Optical links - Parallel processing systems - Phototransistors - Surface mount technology;
D O I：
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中图分类号：
学科分类号：
摘要：
This paper reviews recent progress in the integration and packaging of two-dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL's with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2-D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined.
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页码：184 / 192
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