Characterization of 193 nm chemically amplified resist during post exposure bake and post exposure delay

被引:0
|
作者
Department of Physics, Hanyang University, Ansan, Kyunggido 425-791, Korea, Republic of [1 ]
机构
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Characterization of fluoropolymers for 157 nm chemically amplified resist
    Itani, T
    Toriumi, M
    Naito, T
    Ishikawa, S
    Miyoshi, S
    Yamazaki, T
    Watanabe, M
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (06): : 2705 - 2708
  • [32] In-situ measurement of outgassing from chemically amplified resist during exposure to 248nm light
    Sekiguchi, A
    Isono, MR
    Kono, Y
    Sensu, Y
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2004, 17 (01) : 107 - 113
  • [33] Modification of development parameters of 193 nm chemically amplified resist with pattern density
    Seo, EJ
    Sohn, YS
    Bak, HJ
    Oh, HK
    Woo, S
    Seong, N
    Cho, HK
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVIII, PTS 1 AND 2, 2001, 4345 : 963 - 972
  • [34] Fabrication of a high-resolution mask by using variable-shaped electron beam lithography with a non-chemically amplified resist and a post-exposure bake
    Miyoshi, Hidetatsu
    Taniguchi, Jun
    MICROELECTRONIC ENGINEERING, 2015, 143 : 48 - 54
  • [35] Effect of Post Exposure Bake in Inorganic Electron Beam Resist and Utilizing for Nanoimprint Mold
    Shizuno, Miyako
    Taniguchi, Jun
    Ogino, Kenta
    Ishikawa, Kiyoshi
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2009, 9 (01) : 562 - 566
  • [36] Fabrication of the nanoimprint mold using inorganic electron beam resist with post exposure bake
    Unno, Noriyuki
    Taniguchi, Jun
    Shizuno, Miyako
    Ishikawa, Kiyoshi
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (06): : 2390 - 2393
  • [37] Generation and relaxation of free volume during the post exposure bake
    Stewart, MD
    Burns, SD
    Schmid, GM
    Willson, CG
    MICROPROCESSES AND NANOTECHNOLOGY 2000, DIGEST OF PAPERS, 2000, : 94 - 95
  • [38] Post-exposure delay stability for 193 nm single-layer photoresist: Solvent effect
    Hwang, SH
    Jung, JC
    JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2000, 38 (01) : 148 - 153
  • [39] Novel single-layer chemically amplified resist for 193-nm lithography
    Choi, SJ
    Kang, Y
    Jung, DW
    Park, CG
    Moon, JT
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XIV, 1997, 3049 : 104 - 112
  • [40] Parameter extraction for 193 nm chemically amplified resist from refractive index change
    Sohn, YS
    Oh, HK
    An, I
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (06): : 2077 - 2081