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- [1] Characterization of 193 nm chemically amplified resist during post exposure bake and post exposure delay JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (12B): : 7094 - 7098
- [3] Temperature rising effect of 193 nm chemically amplified resist during post exposure bake ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2, 2000, 3999 : 1000 - 1008
- [4] Effect of temperature variation during post exposure bake on 193 nm chemically amplified resist simulation MICROPROCESSES AND NANOTECHNOLOGY 2000, DIGEST OF PAPERS, 2000, : 100 - 101
- [6] Chemistry and physics of the post-exposure bake process in a chemically amplified resist Hinsberg, William, 2000, PennWell Publ Co, Tulsa, OK, United States (09):
- [7] New models for the simulation of post-exposure bake of chemically amplified resist ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XX, PTS 1 AND 2, 2003, 5039 : 1132 - 1142
- [8] Refractive index change during exposure for 193 nm chemically amplified resist MICROLITHOGRAPHY 1999: ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVI, PTS 1 AND 2, 1999, 3678 : 643 - 650
- [9] Soft bake effect in 193 nm chemically amplified resist ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2, 2000, 3999 : 1062 - 1069
- [10] Improvement of post exposure delay stability of chemically amplified positive resist PHOTOMASK AND X-RAY MASK TECHNOLOGY VI, 1999, 3748 : 62 - 68