Alloys for Electrodeposition in Electronics.

被引：0

作者：

Bogenschuetz, A.F.

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来源：

Galvanotechnik | 1976年 / 67卷 / 11期

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摘要：

A review is presented of the various, mostly binary and partly ternary and quaternary alloys which can be employed advantageously for electrodeposition in the manufacture of electronic circuits and contacts. Covered are various noble metal, lead, nickel, tin, NiP, NiB, and iron-base alloys.

引用

页码：875 / 887

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