COMPACT PACKAGING TECHNIQUE.

被引：0
|
作者：
Swindal, W.N.
机构：
来源：
IBM technical disclosure bulletin | 1984年 / 27卷 / 03期
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摘要：
A technique for obtaining greater thermal dissipation in system packaging is described. Advantage is taken of flexible media to minimize volume requirements while eliminating typical planar or card on-board packages, thereby decreasing to less than fifty percent the cost of typical packages and improving I/O capacity.
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页码：1634 / 1635
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