Patent survey on semiconductors

Three Japanese patents reflecting technological improvements in semiconducting thin films, substrates, and integrated circuit manufacture are reviewed. One is a method developed for forming a semiconductor thin film applicable to a constituent element of a three-dimensional integrated circuit or to a large area electronic device. Another is a technology for manufacturing a substrate for semiconductor devices which is formed by bonding wafers together. The third is an apparatus for the preparation of a titanium-layer for highly integrated circuits by chemical vapour phase separation.