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- [31] Research on Mixed Assembly Soldering Technology of Leaded BGA with Low Temperature Resistance and Lead-Free BGA 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [32] Lead-free solder evaluation for ball attache process PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 6 - 10
- [33] High drop test reliability: Lead-free solders 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1304 - 1309
- [34] Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Journal of Electronic Materials, 2010, 39 : 1218 - 1232
- [37] A comparative study on drop test performance of fine pitch BGA assemblies using Pb-free and tin-lead solders 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 865 - +
- [38] Minimizing the risk of tin whisker formation in lead-free assemblies Transactions of the Institute of Metal Finishing, 2015, 30 (02): : 80 - 82
- [39] Developing the Stencil Printing Process for 01005 Lead-Free Assemblies 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 841 - +
- [40] PCB designer's notebook: Lead-free marking for assemblies SMT Surf Mount Technol Mag, 2006, 1 (14):