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- [1] Gapless Rework and Reliability of Lead-Free BGA Assemblies 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1259 - 1264
- [2] Rework and reliability of QFP and BGA lead-free assemblies PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 194 - 199
- [3] Drop test reliability improvement of lead-free fine pitch BGA using different solder ball composition PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 255 - 261
- [5] Drop impact life prediction model for lead-free BGA packages and modules THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2005, : 559 - 565
- [7] Research on failure modes of BGA assemblies with lead-free solder on different PCB materials FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 396 - 400
- [8] Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2005, : 259 - 262
- [9] Effects of Multiple Rework on the Reliability of Lead-Free Ball Grid Array Assemblies 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 979 - 983
- [10] Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (11): : 1824 - 1831