Effects of Solder Amount in Testing Wetting Agents.

被引：0
|
作者：
Yasuda, Tomio
机构：
来源：
Schweissen und Schneiden/Welding and Cutting | 1977年 / 29卷 / 12期
关键词：
D O I：
暂无
中图分类号：
TG4 [焊接、金属切割及金属粘接];
学科分类号：
080201 ; 080503 ;
摘要：
The amount of solder used for a joint has large effects on the results in wetting behavior of fluxes and the quality of the soldered joint. Guidelines are given for adequate amounts of solder in wetting tests.
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页码：490 / 491
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