Effects of Solder Amount in Testing Wetting Agents.

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作者
Yasuda, Tomio
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中图分类号
TG4 [焊接、金属切割及金属粘接];
学科分类号
080201 ; 080503 ;
摘要
The amount of solder used for a joint has large effects on the results in wetting behavior of fluxes and the quality of the soldered joint. Guidelines are given for adequate amounts of solder in wetting tests.
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页码:490 / 491
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