Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate

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作者：
Oregon State Univ, Corvallis, United States [1 ]
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来源：
IEEE Top Meet Ekectr Perform Electron Packag | / 185-188期
关键词：
Computer aided design - Computer simulation - Electric currents - Electric network analysis - Equivalent circuits - Mathematical models - Silicon wafers;
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摘要：
A CAD-oriented modeling approach for on-chip interconnects on lossy silicon substrate is presented. The frequency-dependent line parameters for single and coupled interconnects are obtained by a modified spectral domain approach that takes into account both the shunt and longitudinal substrate currents. Equivalent circuit models with ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE-compatible models is in excellent agreement with the frequency-dependent characteristics of the interconnects.
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