Solder bump formation method using ball mounting technology

被引：0
|
作者：
Tago, Masamoto
Ueoka, Yoshito
Kato, Yoshimasa
Kono, Eiichi
Furuya, Kenji
Morishige, Sueo
机构：
来源：
NEC Research and Development | 2000年 / 41卷 / 03期
关键词：
Flip chip devices - Soldering;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
We have developed a solder bump formation method that uses a ball mounting technology: a solder ball picker that can be used for flip-chip interconnection. This invention is a new vacuum head that can pick up 5,000 solder balls (120 μm diameter, 200 μm lattice pitch) at one time without error or jamming. The solder balls are mounted on a flux-coated LSI chip, reflowed and cleaned. In tests, 5,000 solder bumps were successfully formed on an LSI chip.
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页码：289 / 293
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