Automated ribbon bonding

被引:0
|
作者
Benton, Bradley K. [1 ]
机构
[1] Palomar Technologies Inc, Vista, United States
来源
Advanced Packaging | 1999年 / 8卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
1
引用
收藏
页码:25 / 26
相关论文
共 50 条
  • [41] AUTOMATED TAPE CARRIER BONDING FOR HYBRIDS
    OSWALD, RG
    MONTANTE, JM
    RODRIGUESDEMIRANDA, WR
    SOLID STATE TECHNOLOGY, 1978, 21 (03) : 39 - 48
  • [42] TAPE AUTOMATED BONDING SYSTEMS.
    Keizer, Alan
    Thompson, John
    New Electronics, 1980, 13 (11):
  • [43] ADVANCES IN AUTOMATED WIRE AND DIE BONDING
    HUENERS, BW
    DAY, DM
    SOLID STATE TECHNOLOGY, 1983, 26 (03) : 69 - 76
  • [44] TAPE AUTOMATED BONDING MOVING INTO PRODUCTION
    DEHAINE, G
    KURZWEIL, K
    SOLID STATE TECHNOLOGY, 1975, 18 (10) : 46 - 52
  • [45] Gold ribbon bonding for microelectronic interconnection: A designed experiment to evaluate process opportunities
    Conway, CM
    Cavanah, NL
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 681 - 687
  • [46] Bonding Properties of Ribbon/Silicon Cell Joints Obtained by Infrared Lamp Soldering
    Son, Hyoung Jin
    Lee, Jung Jin
    Kim, Sung Hyun
    JOURNAL OF NANOELECTRONICS AND OPTOELECTRONICS, 2018, 13 (12) : 1777 - 1783
  • [47] Aluminum ribbon bonding technology in a new package of high power and thermal performance
    Zhang, Huiliang
    Yang, Hongbo
    Zhou, Ming
    Tsui, Anthony C.
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 367 - 369
  • [48] In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding
    Takahashi, Yasuo
    Takashima, Kazumasa
    Misawa, Kouta
    Takaoka, Yusuke
    APPLIED SCIENCES-BASEL, 2019, 9 (09):
  • [49] A study on the reliability and thermo-mechanical properties of gold ribbon wire bonding
    Tan, CW
    Chan, YC
    Liu, HD
    Leung, BNW
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 377 - 382
  • [50] REVIEW OF WATER BUMPING FOR TAPE AUTOMATED BONDING
    LIU, TS
    RODRIGUESDEMIRANDA, WR
    ZIPPERLIN, PR
    SOLID STATE TECHNOLOGY, 1980, 23 (03) : 71 - 76