Electronics interconnections for extreme environments

被引：0
|
作者：
Harman, George G. [1 ]
机构：
[1] NIST, Semiconductor Electron. Div., Gaithersburg, MD 20899, United States
来源：
Advanced Packaging | 2004年 / 13卷 / 02期
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学科分类号：
摘要：
Electronics packaging
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页码：13 / 14
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