共 50 条
- [22] DESIGN OF RECEPTACLE LASER-DIODE MODULES WITH LOW REFLECTION ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 1995, 78 (03): : 71 - 79
- [23] PACKAGING BY PASSIVE COOLING REDUCES MANUFACTURING COSTS OF LASER-DIODE ARRAYS LASER FOCUS WORLD, 1994, 30 (10): : 155 - &
- [25] A NEW PACKAGING TECHNIQUE USING A FILM CARRIER FOR LASER-DIODE ARRAYS IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 395 - 401
- [26] MATCHING OF SINGLE-MODE FIBER TO LASER-DIODE BY MICROLENSES AT 1.5 MU-M WAVELENGTH IEE PROCEEDINGS-OPTOELECTRONICS, 1994, 141 (03): : 178 - 184