Novel millimeter-wave IC on Si substrate using flip-chip bonding technology

被引：0
|
作者：
Matsushita Electric Industrial Co, Ltd, Moriguchi-shi, Japan [1 ]
机构：
来源：
IEICE Trans Electron | / 8卷 / 971-978期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
12
引用
下载
收藏
相关论文
共 50 条
  • [41] Development of flip-chip bonding technology for (Cd,Zn)Te
    Fiederle, M
    Braml, H
    Fauler, A
    Giersch, J
    Ludwig, J
    Jakobs, K
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2004, 51 (04) : 1799 - 1802
  • [42] Development of flip-chip bonding technology for (Cd,Zn)Te
    Fiederle, M
    Braml, H
    Fauler, A
    Giersch, J
    Ludwig, J
    Anton, G
    Jakobs, K
    2003 IEEE NUCLEAR SCIENCE SYMPOSIUM, CONFERENCE RECORD, VOLS 1-5, 2004, : 232 - 236
  • [43] Silver Flip-Chip Technology by Solid-State Bonding
    Wang, Pin J.
    Lee, Chin C.
    JOURNAL OF ELECTRONIC PACKAGING, 2010, 132 (03)
  • [44] Monolithic LED Microdisplay on Active Matrix Substrate Using Flip-Chip Technology
    Liu, Zhao Jun
    Wong, Ka Ming
    Keung, Chi Wing
    Tang, Chak Wah
    Lau, Kei May
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2009, 15 (04) : 1298 - 1302
  • [45] FLIP-CHIP BONDING USING SUPERCONDUCTING SOLDER BUMP
    OGASHIWA, T
    NAKAGAWA, H
    AKIMOTO, H
    SHIGYO, H
    TAKADA, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (8A): : 4043 - 4046
  • [46] Flip-chip bonding using superconducting solder bump
    Ogashiwa, Toshinori
    Nakagawa, Hiroshi
    Akimoto, Hideyuki A.
    Shigyo, Hiroyuki
    Takada, Susumu
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (8 A): : 4043 - 4046
  • [47] Low-cost flip-chip alternatives for millimeter wave applications
    Heyen, J
    Schroeder, J
    Jacob, AF
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 2205 - 2208
  • [48] The technology of flip chip bonding on an organic substrate for PDA
    Makabe, A
    Kurashima, Y
    Shimizu, S
    Inoue, S
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 287 - 292
  • [49] Novel micro-bump fabrication for flip-chip bonding
    Takao Ishii
    Shinji Aoyama
    Journal of Electronic Materials, 2004, 33 : L21 - L23
  • [50] Novel micro-bump fabrication for flip-chip bonding
    Ishii, T
    Aoyama, S
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (11) : L21 - L23
12345