Trends in advanced packaging design

被引：0

作者：

Rinebold, Kevin ^{[1
]}

Landers, Leslie ^{[1
]}

Schaertl, Lisa ^{[1
]}

机构：

[1] Xyntix Design Systems, Fishers, United States

来源：

Advanced Packaging | 1999年 / 8卷 / 01期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[21] TRENDS IN PACKAGING
BAHLER, P
CHIMIA, 1974, 28 (04) : 206 - 209
[22] Packaging trends
Warth, AH
INDUSTRIAL AND ENGINEERING CHEMISTRY, 1943, 35 : 43 - 46
[23] Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
JOURNAL OF ELECTRONIC PACKAGING, 2024, 146 (01)
[24] PACKAGING TRENDS
SAAL, H
KREBS, RJ
AMERICAN DAIRY REVIEW, 1973, 35 (08): : 31 - 38
[25] Packaging trends
4708 Morningside Drive, Cleveland, OH 44109, United States
Pharm. Technol., 2007, 3 (44-48):
[26] Trends in packaging - A challenge for packaging adhesives
Trends in der Verpackung - Eine Herausforderung für Verpackungsklebstoffe
Onusseit, Hermann, 1600, Friedr. Vieweg und Sohn Verlags GmbH (48):
[27] Advanced packaging and MOS/LSI used in miniature computer design
GOLDSTEIN AD
1971, 10 (12): : 35 - 40
[28] Shielding design optimizing EMC characteristics in advanced MCM packaging
Brandolini, A
Gandelli, A
Zich, RE
FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS, 2000, : 121 - 124
[29] DESIGN OF MULTILAYERED POLYMERIC DIELECTRIC INSULATORS FOR ADVANCED MICROELECTRONICS PACKAGING
PARK, YT
CHIESEL, N
ECONOMY, J
MOLECULAR CRYSTALS AND LIQUID CRYSTALS SCIENCE AND TECHNOLOGY SECTION A-MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 1994, 247 : 351 - 363
[30] Polymers and packaging: The role of integrated testing in advanced structure design
Hanton, Scott
Johnson, Gary
Zielinski, John
McDaniel, Paula
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2016, 252