Predicted thermal mismatch stresses in a cylindrical bi-material assembly adhesively bonded at its ends

被引：0
|
作者：
Suhir, E. [1 ]
机构：
[1] Bell Lab, Murray Hill, United States
来源：
Journal of Applied Mechanics, Transactions ASME | 1997年 / 64卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：15 / 22
相关论文
共 37 条
  • [1] Predicted thermal mismatch stresses in a cylindrical bi-material assembly adhesively bonded at its ends
    Suhir, E
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 1997, 64 (01): : 15 - 22
  • [2] Predicted thermal mismatch stresses in a cylindrical bi-material assembly adhesively bonded at its ends
    Suhir, E.
    Journal of Applied Mechanics, Transactions ASME, 1997, 64 (01): : 15 - 22
  • [3] Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends
    Suhir, E
    JOURNAL OF APPLIED PHYSICS, 2001, 89 (01) : 120 - 129
  • [4] An improved adhesively bonded bi-material beam model for plated beams
    Qiao, Pizhong
    Chen, Fangliang
    ENGINEERING STRUCTURES, 2008, 30 (07) : 1949 - 1957
  • [5] Interfacial Stresses in a Bi-material Assembly Subjected to External Tensile Forces and Bending Moments Applied to the Ends of One of Its Components
    Suhir, E.
    Vujosevic, M.
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 692 - +
  • [6] Interfacial stresses in a bi-material assembly with a compliant bonding layer
    Suhir, E.
    Vujosevic, M.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2008, 41 (11)
  • [7] Theoretical analysis of mode I fracture of adhesively bonded bi-material DCB joints
    Wang, Wandong
    Zhang, Shijie
    He, Rui
    Zhu, Yangxuan
    Zhao, Tian
    Yao, Xudan
    Ma, Yu'e
    ENGINEERING FRACTURE MECHANICS, 2024, 309
  • [8] Damage characterization of adhesively-bonded Bi-material joints using acoustic emission
    Saeedifar, Milad
    Saleh, Mohamed Nasr
    De Freitas, Sofia Teixeira
    Zarouchas, Dimitrios
    COMPOSITES PART B-ENGINEERING, 2019, 176
  • [9] Elastic solution for a rotating bi-material ring with thermal mismatch
    Suo, Xufei
    Wang, Tingkang
    Li, Zefang
    Shen, Yongxing
    MECHANICS RESEARCH COMMUNICATIONS, 2021, 113
  • [10] Interfacial thermal stresses in a bi-material assembly with a low-yield-stress bonding layer
    Suhir, E.
    MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2006, 14 (08) : 1421 - 1432
1234