Voids in BGAs

被引：0
|
作者：
Prasad, Ray P. [1 ]
机构：
[1] BeamWorks Inc., P.O. Box 219179, Portland, OR 97225, United States
来源：
SMT Surface Mount Technology Magazine | 2001年 / 15卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] BGAS MAKE TRANSITION TO MEMORY PACKAGES
    MALINIAK, D
    ELECTRONIC DESIGN, 1993, 41 (21) : 34 - +
  • [32] A Guide to Infrared (IR) rework on bgas
    Gibbs, Roger
    SMT Surface Mount Technology Magazine, 2009, 23 (03):
  • [33] Implementing an effective solution for inspecting BGAs
    Zarkoob, B
    EE-EVALUATION ENGINEERING, 2000, 39 (10): : 100 - +
  • [34] Application of Contactless Testing to PCBs with BGAs and Open Sockets
    Renbi, Abdelghani
    Delsing, Jerker
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2015, 31 (04): : 339 - 347
  • [35] PERIMETER BGAS PROMISE EASIER ROUTING, HIGHER PERFORMANCE
    CHIN, S
    ELECTRONIC PRODUCTS MAGAZINE, 1995, 37 (08): : 17 - 17
  • [36] Application of Contactless Testing to PCBs with BGAs and Open Sockets
    Abdelghani Renbi
    Jerker Delsing
    Journal of Electronic Testing, 2015, 31 : 339 - 347
  • [37] Does BGAs require new PCB-Technologies?
    Budweiser, Werner
    F and M; Feinwerktechnik, Mikrotechnik, Messtechnik, 1995, 103 (11-12): : 687 - 690
  • [38] Incorporating BGAs into high volume assembly operations
    Partridge, Julian
    Electronic Packaging and Production, 1997, 37 (11): : 46 - 50
  • [39] Cost effective approach to fine pitch BGAs
    Miks, J
    Daniels, D
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 154 - 159
  • [40] Accessing Adhesive Induced Risk for BGAs in Temperature Cycling
    Arakere, Guruprasad
    Vujosevic, Milena
    Pei, Min
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 395 - 403
12345