Reliability of anisotropic conductive adhesive joints in electronic packaging applications

被引：0
|
作者：
Lin, Y.C. [1 ,2 ]
Chen, X. [1 ]
机构：
[1] School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China
[2] School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
来源：
| 1631年 / VSP BV卷 / 22期
关键词：
New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular; anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits; ACA-type packages pose several reliability problems. During the last 10 years; tremendous research and development efforts have been spent on improving the reliability of ACA joints. In this paper; the effects of the bonding process (including the bonding temperature; bonding pressure; curing conditions and reflow processes) on the reliability of ACA joints are presented. Then the effects of the environmental factors (including high temperature; humidity; thermal cycling; impact load; etc.) on the reliability of ACA joints are discussed. Finally; the effects of the properties of the components (including properties of substrates; ACAs; conductive particles and the bump height) on the reliability of ACA joints are reviewed. Additionally; future research areas and remaining issues are pointed out. © 2008 VSP;
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