Measurement of pressure distribution during encapsulation of flip chips

被引：0
|
作者：
Schreier-Alt, Thomas [1 ]
Stark, Jeffrey G. [2 ]
机构：
[1] Fraunhofer IZM - MMZ, Germany
[2] Sensor Products, Inc., United States
来源：
SMT Surface Mount Technology Magazine | 2010年 / 25卷 / 08期
关键词：
Flip chip devices;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Homogenous pressure distribution within the molding cavity is of particular importance for encapsulation of mechanically-sensitive electronic components, e.g., MEMS sensors, bare dies and flip chips. With the implementation of specially multilayered sensor films, a fast estimation of the pressure distribution within the cavity will be possible.
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页码：40 / 46
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