Dynamic crack-tip stress and displacement fields under thermomechanical loading in functionally graded materials

被引：0
|
作者：
Lee, Kwang Ho [2 ]
Chalivendra, Vijaya Bhaskar [3 ]
Shukla, Arun [1 ,4 ]
机构：
[1] ASME
[2] Department of Automotive Engineering, Kyungpook National University, Sangju City, Kyeongbuk 742-711, Korea, Republic of
[3] Department of Mechanical Engineering, University of Massachusetts Dartmouth, North Dartmouth, MA 02747, United States
[4] Dynamic Photomechanics Laboratory, University of Rhode Island, Kingston, RI 02881, United States
来源：
Journal of Applied Mechanics, Transactions ASME | 2008年 / 75卷 / 05期
关键词：
Thermomechanical stress and displacement fields for a propagating crack in functionally graded materials (FGMs) are developed using displacement potentials and asymptotic analysis. The shear modulus; mass density; and coefficient of thermal expansion of the FGMs are assumed to vary exponentially along the gradation direction. Temperature and heat flux distribution fields are also derived for an exponential variation of thermal conductivity. The mode mixity due to mixed-mode loading conditions around the crack tip is accommodated in the analysis through the superposition of opening and shear modes. Using the asymptotic stress fields; the contours of isochromatics (contours of constant maximum shear stress) are developed and the results are discussed for various crack-tip thermomechanical loading conditions. Copyright © 2008 by ASME;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Conference article (CA)
引用
收藏
页码：051101 / 051101
相关论文
共 50 条
  • [1] Dynamic crack-tip stress and displacement fields under thermomechanical loading in functionally graded materials
    Lee, Kwang Ho
    Chalivendra, Vijaya Bhaskar
    Shukla, Arun
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2008, 75 (05):
  • [2] Crack-tip stress fields for dynamic fracture in functionally gradient materials
    Parameswaran, V
    Shukla, A
    MECHANICS OF MATERIALS, 1999, 31 (09) : 579 - 596
  • [3] Crack-tip stress fields in functionally graded materials with linearly varying properties
    Jain, N
    Rousseau, CE
    Shukla, A
    THEORETICAL AND APPLIED FRACTURE MECHANICS, 2004, 42 (02) : 155 - 170
  • [4] Crack-tip stress fields for dynamic fracture in functionally gradient materials
    Dynamic Photomechanics Laboratory, Dept. Mech. Eng. Appl. Mechanics, U., Kingston, RI 02881-0805, United States
    Mech Mater, 9 (579-596):
  • [5] Stress and displacement fields at a transient crack tip propagating in functionally graded materials
    Lee, Kwang Ho
    Ban, Gap Su
    MECHANICAL BEHAVIOR OF MATERIALS X, PTS 1AND 2, 2007, 345-346 : 481 - +
  • [6] Mixed-mode crack-tip stress fields for orthotropic functionally graded materials
    Chalivendra, Vijaya Bhaskar
    ACTA MECHANICA, 2009, 204 (1-2) : 51 - 60
  • [7] Mixed-mode crack-tip stress fields for orthotropic functionally graded materials
    Vijaya Bhaskar Chalivendra
    Acta Mechanica, 2009, 204 : 51 - 60
  • [8] Crack-tip stress fields for an arbitrarily oriented crack in a functionally graded material
    Dai, Y.
    Yan, X. F.
    Sun, C. Q.
    Tan, W.
    ADVANCES IN HETEROGENEOUS MATERIAL MECHANICS 2008, 2008, : 701 - 704
  • [9] The Crack-Tip Fields of Reissner's Plates of Radial Functionally Graded Materials
    Dai Yao
    Liu Jun-feng
    Zhang Peng
    HIGH PERFORMANCE STRUCTURES AND MATERIALS ENGINEERING, PTS 1 AND 2, 2011, 217-218 : 1319 - 1323
  • [10] Numerical analysis of crack-tip fields in functionally graded materials with a crack normal to the elastic gradient
    Marur, PR
    Tippur, HV
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2000, 37 (38) : 5353 - 5370
12345