Endurance of lead-free assembly under board level drop test and thermal cycling

被引：0
|
作者：
Xia, Yanghua [1 ]
Xie, Xiaoming [1 ]
机构：
[1] State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, China
来源：
Journal of Alloys and Compounds | 2008年 / 457卷 / 1-2期
关键词：
32;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：198 / 203
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