Numerical simulation of 3D transient temperature field in aluminum alloy solidification process

被引：0
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作者：
Sui, Da-Shan [1 ]
Cui, Zhen-Shan [1 ]
机构：
[1] National Die and Mould CAD Engineering Research Center, Shanghai Jiaotong University, Shanghai 200030, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2008年 / 18卷 / 07期
关键词：
16;
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页码：1311 / 1316
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