共 50 条
- [33] Thermal-mechanical Simulation of Embedded Module based on Organic Substrate 2013 IEEE INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS (APM), 2013,
- [34] Thermal-mechanical loading sequences related creep aging behaviors of 7050 aluminum alloy Li, H. (liheng@nwpu.edu.cn), 1600, Elsevier Ltd (731):
- [37] Thermal-mechanical coupling analysis of 3D printing nozzle based on Ansys SECOND IYSF ACADEMIC SYMPOSIUM ON ARTIFICIAL INTELLIGENCE AND COMPUTER ENGINEERING, 2021, 12079
- [39] Influence of mechanical behavior between the grains on stress fluctuation of aluminum alloy thick plate Journal of Wuhan University of Technology-Mater. Sci. Ed., 2013, 28 : 1212 - 1216
- [40] Influence of Mechanical Behavior between the Grains on Stress Fluctuation of Aluminum Alloy Thick Plate JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION, 2013, 28 (06): : 1212 - 1216