Finite element simulation of temperature fields of gypsum wallboard in heat pump drying process

被引：0
|
作者：
Zhu, Gui-Hua [1 ]
Gao, Xu-Guang [1 ]
Li, Kang [1 ]
Hu, Jun-Ping [1 ]
He, Jiang-San [1 ]
机构：
[1] School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
来源：
Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology) | 2010年 / 41卷 / 05期
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页码：1828 / 1833
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