Development of electroless silver plating on Para-aramid fibers and growth morphology of silver deposits

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机构：

[1] Zhang, Huiru

[2] Zou, Xinguo

[3] Liang, Jingjing

[4] Ma, Xiao

[5] Tang, Zhiyong

[6] Sun, Jinliang

来源：

Zhang, H. (zhanghuiru@shu.edu.cn) | 1600年 / John Wiley and Sons Inc卷 / 124期

关键词：

The development of a conductive fiber with flame resistance is an urgent concern particularly in national defense and other specialized fields. Aramid fibers (para- or meta-) exihibit high strength and excellent fire resistance. Electroless silver plating on para-aramid fibers and growth morphology of silver deposits was investigated in the present work. The surface of para-aramid fibers was roughened using sodium hydride/dimethyl sulfoxide to guarantee successful electroless plating. Two complexing agents (ethylene diamine/ammonia) and two reducing agents (glucose/seignette salt) were used for the electroless silver plating bath design. Structure and properties of the resulting silver-deposited para-aramid fibers were evaluated based on scanning electron microscopy; silver weight gain percentage calculation; electrical resistance measurement; crystal structure analysis; and mechanical properties test. The results showed that a higher silver weight gain was advantageous to the improvement of conductivity for the silver-deposited para-aramid fibers. The obtained silver deposit was homogenous and compact. Electroless silver-plating deposits were considered to be three-dimensional nucleation and growth model (Volmer-Weber). Black; silver gray; and white deposits appeared sequentially with progressive plating. The breaking strength of silver-deposited para-aramid fibers remained at value up to 44 N. © 2011 Wiley Periodicals; Inc;

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