Chemical mechanical polishing research of CdZnTe functional crystalline with soft brittle nature

被引:4
|
作者
Key Laboratory for Precision and Non-traditional Machining Technology, Dalian University of Technology, Dalian 116024, China [1 ]
机构
来源
Jixie Gongcheng Xuebao | 2008年 / 12卷 / 215-220+225期
关键词
10;
D O I
10.3901/JME.2008.12.215
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [32] Research on Chemical Mechanical Polishing Technology for Zirconium-Based Amorphous Alloys
    Hang, Wei
    Song, Chao
    Yin, Ziliang
    Liu, Ye
    Wang, Qifan
    Wang, Yinggang
    Ma, Yi
    Zeng, Qiaoshi
    MICROMACHINES, 2023, 14 (03)
  • [33] Material removal model of ultrasonic elliptical vibration-assisted chemical mechanical polishing for hard and brittle materials
    Liu, Defu
    Yan, Riming
    Chen, Tao
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 92 (1-4): : 81 - 99
  • [34] Research on abrasives in the chemical-mechanical polishing process for silicon nitride balls
    Yuan, JL
    Lü, BH
    Lin, X
    Zhang, LB
    Ji, SM
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2002, 129 (1-3) : 171 - 175
  • [35] Material removal model of ultrasonic elliptical vibration-assisted chemical mechanical polishing for hard and brittle materials
    Defu Liu
    Riming Yan
    Tao Chen
    The International Journal of Advanced Manufacturing Technology, 2017, 92 : 81 - 99
  • [36] Research on weakly alkaline bulk slurries relevant to chemical mechanical polishing for cobalt interconnects
    Lifei Zhang
    Tongqing Wang
    Xinchun Lu
    The International Journal of Advanced Manufacturing Technology, 2023, 125 : 4549 - 4559
  • [37] Research on the hydrodynamic electro-chemical mechanical polishing for silicon wafer with suspension fluid
    Zhan, Jianming
    Zheng, Di
    ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XIV, 2008, 359-360 : 290 - 294
  • [38] A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
    Han Yan
    Xinhuan Niu
    Minghui Qu
    Fu Luo
    Ni Zhan
    Jianghao Liu
    Yida Zou
    The International Journal of Advanced Manufacturing Technology, 2023, 125 : 47 - 71
  • [39] Modeling and experimental research on a removal mechanism during chemical mechanical polishing at the molecular scale
    An Wei
    Zhao Yongwu
    Wang Yongguang
    JOURNAL OF SEMICONDUCTORS, 2010, 31 (11) : 1160051 - 1160054
  • [40] Modeling and experimental research on a removal mechanism during chemical mechanical polishing at the molecular scale
    安伟
    赵永武
    王永光
    半导体学报, 2010, 31 (11) : 146 - 149