Effect of defect size on the measurement of defect depth using thermal wave imaging

被引:0
|
作者
Zeng, Zhi [1 ,2 ]
Tao, Ning [2 ]
Feng, Lichun [2 ]
Zhang, Cunlin [2 ]
机构
[1] Institute of Physics and Electronic Engineering, Chongqing Normal University, Chongqing 400047, China
[2] Key Laboratory of Terahertz Optoelectronics, Department of Physics, Capital Normal University, Beijing 100048, China
关键词
Defects - Thickness gages - Fiber reinforced plastics - Diffusion - Heat conduction;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1910 / 1915
相关论文
共 50 条
  • [31] Automatic defect detection in a steel sample using frequency-modulated thermal wave imaging
    Ahmad, J.
    Mulaveesala, R.
    [J]. INSIGHT, 2023, 65 (09): : 501 - 507
  • [32] Measurement of delamination size and depth in ceramic matrix composites using pulsed thermal imaging
    Sun, JG
    Erdman, S
    Connolly, L
    [J]. 27TH INTERNATIONAL COCOA BEACH CONFERENCE ON ADVANCED CERAMICS AND COMPOSITES: B, 2003, 24 (04): : 201 - 206
  • [34] Quantitative Measurement of Defect Depth Using Pulsed Thermography: A Comparative Study
    Leksir, Yazid Laib Dit
    Amouri, Ammar
    Guerfi, Kadour
    Moussaoui, Abdelkrim
    [J]. RUSSIAN JOURNAL OF NONDESTRUCTIVE TESTING, 2023, 59 (06) : 724 - 735
  • [35] The effect of flash power on the measurement of thermal effusivity using thermal wave imaging
    Zeng, Zhi
    Tao, Ning
    Feng, Lichun
    Li, Yue
    Zhang, Cunlin
    [J]. INTERNATIONAL SYMPOSIUM ON PHOTOELECTRONIC DETECTION AND IMAGING 2011: ADVANCES IN INFRARED IMAGING AND APPLICATIONS, 2011, 8193
  • [36] Quantitative Measurement of Defect Depth Using Pulsed Thermography: A Comparative Study
    Yazid Laib Dit Leksir
    Ammar Amouri
    Kadour Guerfi
    Abdelkrim Moussaoui
    [J]. Russian Journal of Nondestructive Testing, 2023, 59 : 724 - 735
  • [37] Simultaneous measurement of size and depth of each defect in a silicon wafer using light scattering at two wavelengths: Principle, limitation and applications of optical shallow defect analyzer
    Takeda, Kazuo
    Isomae, Seiichi
    Ohkura, Makoto
    Maeshima, Muneo
    Matsui, Shigeru
    [J]. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1999, 38 (6 A): : 3776 - 3783
  • [38] Simultaneous measurement of size and depth of each defect in a silicon wafer using light scattering at two wavelengths: Principle, limitation and applications of optical shallow defect analyzer
    Takeda, K
    Isomae, S
    Ohkura, M
    Maeshima, M
    Matsui, S
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (6A): : 3776 - 3783
  • [39] Defect detection in concrete structures using thermal imaging techniques
    S. Bhalla
    S. Tuli
    R. Arora
    [J]. Experimental Techniques, 2011, 35 : 39 - 43
  • [40] DEFECT DETECTION IN CONCRETE STRUCTURES USING THERMAL IMAGING TECHNIQUES
    Bhalla, S.
    Tuli, S.
    Arora, R.
    [J]. EXPERIMENTAL TECHNIQUES, 2011, 35 (04) : 39 - 43