共 50 条
- [32] Thermal Fatigue Reliability Analysis of PBGA with Sn63Pb37 Solder Joints 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 1104 - 1107
- [36] Thermal Fatigue Life Analysis and Forecast of PBGA Solder Joints On the Flexible PCB Based on Finite Element Analysis 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 1092 - 1095
- [38] Review and Evaluation of S-N Curve Models for Composite Laminates Cailiao Daobao/Materials Reports, 2024, 38 (22):