3-D model of temperature transient effects in FOG fiber coil

被引：0
|
作者：
Zhao, Xiao-Ming [1 ]
Li, Mao-Chun [1 ]
机构：
[1] Tianjin Navigation Instruments Research Institute, Tianjin 300131, China
来源：
Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering | 2010年 / 39卷 / 05期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：929 / 933
相关论文
共 50 条
  • [21] Coil Design for Neuromuscular Magnetic Stimulation Based on a Detailed 3-D Thigh Model
    Goetz, Stefan M.
    Weyh, Thomas
    Afinowi, Ibrahim A. A.
    Herzog, Hans-Georg
    IEEE TRANSACTIONS ON MAGNETICS, 2014, 50 (06)
  • [22] 3-D Analytical Model of Racetrack HTS Coil Subject to Travelling Magnetic Fields
    Zhengwei Zhao
    Shuai Xu
    Kang Liu
    Wenjiao Yang
    Jing Li
    Guangtong Ma
    Journal of Superconductivity and Novel Magnetism, 2021, 34 : 75 - 84
  • [23] Low temperature 3-D ising model using maple
    Frempong-Mireku, P
    Alkahby, H
    Jalbout, AF
    Moriarty, KJM
    Ansong, G
    NEURAL, PARALLEL, AND SCIENTIFIC COMPUTATIONS, VOL 2, PROCEEDINGS, 2002, : 209 - 212
  • [24] Calibration of the 3-D Coil System's Orthogonality
    Zikmund, A.
    Ripka, P.
    IEEE TRANSACTIONS ON MAGNETICS, 2013, 49 (01) : 66 - 68
  • [25] Effective 3-D FEM for large-scale high temperature superconducting racetrack coil
    Huang, Xiangyu
    Huang, Zhen
    Xu, Xiaoyong
    Li, Wan
    Jin, Zhijian
    PROGRESS IN SUPERCONDUCTIVITY AND CRYOGENICS, 2019, 21 (03): : 32 - 37
  • [26] FIBER SENSORS GO 3-D
    Soller, Brian J.
    Rice, Trevor
    PHOTONICS SPECTRA, 2008, 42 (12) : 63 - 66
  • [27] Three-dimensional finite element model of Shupe effect in fog fiber coil
    Key Laboratory of Opto-Electronics Information and Technical Science, Tianjin University, Tianjin 300072, China
    Tianjin Daxue Xuebao (Ziran Kexue yu Gongcheng Jishu Ban), 2008, 5 (601-606):
  • [28] Thermal Transient Analysis and Dynamic Temperature Control Algorithm for 3-D Stacked Chips
    Wang, Songxiang
    Usami, Kimiyoshi
    2022 37TH INTERNATIONAL TECHNICAL CONFERENCE ON CIRCUITS/SYSTEMS, COMPUTERS AND COMMUNICATIONS (ITC-CSCC 2022), 2022, : 614 - 617
  • [29] CALCULATION OF 3-D TRANSIENT TEMPERATURE FIELD DURING LASER TRANSFORMATION HARDENING PROCESS
    L. W Zhang
    ActaMetallurgicaSinica(EnglishLetters), 2000, (02) : 806 - 810
  • [30] Transient 3-D/3-D transport and reactant-wafer interactions: Adsorption and desorption
    Webster, SG
    Gobbert, MK
    Cale, TS
    RAPID THERMAL AND OTHER SHORT-TIME PROCESSING TECHNOLOGIES III, PROCEEDINGS, 2002, 2002 (11): : 81 - 88
12345