共 50 条
- [43] Comparison of polishing pad characteristics in copper-interconnect chemical mechanical polishing of 300 mm wafer Mocaxue Xuebao/Tribology, 2013, 33 (04): : 394 - 399
- [48] Experiment on silicon wafer edge hybrid polishing of ultrasonic vibration and chemical mechanical Nongye Jixie Xuebao/Transactions of the Chinese Society of Agricultural Machinery, 2010, 41 (02): : 221 - 226
- [49] On-line patterned wafer thickness control of chemical-mechanical polishing JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (04): : 1384 - 1390
- [50] Effects of wafer curvature caused by film stress on the chemical mechanical polishing process The International Journal of Advanced Manufacturing Technology, 2009, 40 : 929 - 939