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- [21] Lead-free tin alloys as substitutes for tin-lead alloy plating TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1997, 75 : 149 - 153
- [22] Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies using RF Impedance Analysis 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 663 - 667
- [23] Lead-free tin chalcogenide thermoelectric materials INORGANIC CHEMISTRY FRONTIERS, 2016, 3 (11): : 1449 - 1463
- [25] Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth JOM, 2012, 64 (10) : 1174 - 1175
- [28] On the shear properties of a lead-tin and a lead-free solder PROCESSING AND FABRICATION OF ADVANCED MATERIALS VI, VOLS 1 & 2, 1998, : 383 - 394
- [29] Gapless Rework and Reliability of Lead-Free BGA Assemblies 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1259 - 1264
- [30] Rework and reliability of QFP and BGA lead-free assemblies PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 194 - 199